News Archives - Page 10 of 10 - Kandou AI

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  • A brief history of Kandou Bus

    A brief history of Kandou Bus

    Kandou Bus uses a novel form of spatial coding to transmit data between wired chips. The main idea is to introduce correlations between the signals sent on the interface, and choose the correlations judiciously to lower the power consumption, increase the speed, and lower the footprint. It is a generalization…

  • Startup Promises Bandwidth Boost

    Startup Promises Bandwidth Boost

    SAN FRANCISCO. — A math professor’s observation mushroomed into a startup with two demo chips and three standards efforts. Kandou Bus aims to drive a broad range of chip-to-chip and backplane interconnects down to picojoules/bit rates measured in single digits. Rick Merrit, EETimes…

  • Kandou Resolves Today’s Chip Interconnect Performance/Power Bottleneck for Mobile and Networking Applications

    Kandou Resolves Today’s Chip Interconnect Performance/Power Bottleneck for Mobile and Networking Applications

    Company Announces New Chord™ signaling technology at ISSCC that delivers 2-4X bandwidth improvement and half the power of conventional chip-to-chip links. SAN FRANCISCO, February 10, 2014 – Kandou Bus has announced that the first implementation of its breakthrough high-performance, low-power link technology will be introduced at the 2014 International Solid-State…

  • More power for mobiles & Co., Success Startup

    More power for mobiles & Co., Success Startup

    I also had the chance to catch up with Brian Holden, who can now say more about that secretive startup he had just joined when I saw him at Hot Chips last year. Kandou Bus is developing algorithms for three-wire interconnects it claims will enable new capabilities and efficiencies for…