News Archives - Page 10 of 10 - Kandou

Category: News

  • Kandou Resolves Today’s Chip Interconnect Performance/Power Bottleneck for Mobile and Networking Applications

    Kandou Resolves Today’s Chip Interconnect Performance/Power Bottleneck for Mobile and Networking Applications

    Company Announces New Chord™ signaling technology at ISSCC that delivers 2-4X bandwidth improvement and half the power of conventional chip-to-chip links. SAN FRANCISCO, February 10, 2014 – Kandou Bus has announced that the first implementation of its breakthrough high-performance, low-power link technology will be introduced at the 2014 International Solid-State…

  • More power for mobiles & Co., Success Startup

    More power for mobiles & Co., Success Startup

    I also had the chance to catch up with Brian Holden, who can now say more about that secretive startup he had just joined when I saw him at Hot Chips last year. Kandou Bus is developing algorithms for three-wire interconnects it claims will enable new capabilities and efficiencies for…