Kandou among Europe’s top 50 “super scale-ups” Four Swiss companies, including three EPFL spin-offs – Flyability, Kandou and Nexthink – will be featured among Europe’s top 50 high-tech scale-ups at this year’s Tech Tour Growth Summit. The Summit is an annual event where a panel of international investors selects the…
Presentation Featured During ISSCC’s Forum 4 “Cutting Edge Advances in Electrical and Optical Transceiver Technologies” Download PDF Dr. Amin Shokrollahi, Founder and Chief Executive Officer of Kandou, will present “Future Signaling and Coding: Channel Limitations and Potential Solutions above 112G” during the 2020 International Solid-State Circuits Conference (ISSCC). His…
Two DesignCon Technical Sessions Showcase Kandou’s Signal Integrity Expertise Download PDF Kandou, an innovative leader in high-speed, energy efficient, chip link solutions, will demonstrate its ultra-short reach (USR) SerDes intellectual property (IP) and USB-C® multiprotocol retimer solution with USB4™ support at DesignCon 2020. Demonstrations will be held in…
Matterhorn’s Benefits Include Faster Video Processing, Data Transfer Connections to Drive Next-Generation USB-Enabled Devices Download PDF Matterhorn’s Benefits Include Faster Video Processing, Data Transfer Connections to Drive Next-Generation USB-Enabled Devices Kandou, an innovative leader in high-speed, energy efficient, chip-to-chip link solutions, will demonstrate a working prototype of the industry’s…
Matterhorn’s Benefits Include Faster Video Processing, Data Transfer Connections to Drive Next-Generation USB-Enabled Devices Download PDF Kandou SerDes Leadership Empowers the Next Generation of USB-Enabled Devices Kandou, a global leader in ultra-low power wired connectivity, has announced development is underway for the industry’s first USB-C® multi-protocol retimer solution with…
Kandou Announces 100th Patent Grant by U.S. Patent Office https://t.co/BdCOGixknJ — Kandou (@kandoubus) December 11, 2018…
Semiconductor Engineering publishes a new white paper on Kandou’s Glasswing IP. See Kandou’s Glasswing IP for more information.
Kandou Bus, S.A., a world leader in development of SerDes IP and chip solutions, has completed its Series B investment round with a $15M investment from Bessemer Venture Partners and Walden Investment. The close of the Series B signifies Kandou’s accomplishment of critical research and development milestones and key design…