IP Optimized for High-Speed, Ultra-Low Power Chiplet Interconnects. SAINT-SULPICE, SWITZERLAND – January 18, 2023 Who: Kandou, an innovative leader in high-speed, energy-efficient chip-to-chip link intellectual property (IP) solutions that improve the way the world connects and communicates. What: Will demonstrate Glasswing™ chip-to-chip link intellectual property (IP) optimized for high-speed, ultra-low power ultra-short…
Will Present Kandou Vision and Market-Leading Solutions in One-on-One Meetings with Interested Investors throughout the Conference.
Will Showcase Benefits Including Faster Video Processing, Data Transfer Connections to Drive Next-Generation USB-Enabled Devices. Who: Kandou, an innovative leader in high-speed, energy-efficient chip-to-chip link solutions that improve the way the world connects and communicates. What: Will demonstrate its Matterhorn™ family of USB-C® multiprotocol retimers solutions for USB4® and DisplayPort™ 2.1 at…
Kandou today confirmed its Matterhorn™ KB8010 USB4® retimer is DisplayPort 2.1-compliant as certified by the Video Electronics Standards Association (VESA®). DisplayPort 2.1 enables the next generation of display devices and external monitors. DisplayPort 2.1 certification and VESA logo use means your products have met the highest standards in the industry.
The yearly Thanksgiving weekend tradition of wandering the malls for Black Friday and Cyber Monday specials has given way to “let your fingers do the walking”. Americans and their counterparts around the globe now turn to online shopping to snag deals during these mega retail events. A lot of this…
Exceptional International Investment and Banking Finance Expertise; First-Hand Knowledge, Understanding of Semiconductor R&D, Marketing and Sales Kandou, an innovative leader in high-speed, energy-efficient chip-to-chip link solutions that improve the way the world connects and communicates, today appointed Hanqing (Helen) Li, Managing Director and Head of China Investment Banking for Needham…
Awards to be presented at the GSA Awards celebration on December 8. Kandou, an innovative leader in high-speed, energy-efficient chip-to-chip link solutions that improve the way the world connects and communicates, has been named one of the four finalists in the Global Semiconductor Alliance (GSA) Outstanding EMEA Semiconductor Company Award category.
Kandou’s Dr. Amin Shokrollahi will attend the Morgan Stanley European Technology, Media & Telecom Conference What: They will present Kandou’s vision and product offerings in one-on-one or group meetings with interested investors throughout the Conference. When: Wednesday, November 16, to Friday, November 18. Who: Kandou’s Dr. Amin Shokrollahi, founder and CEO, and Jeff…
Kandou’s Dr. Amin Shokrollahi will be attending Bank of America investor summit What: Bank of America is hosting the latest in the ‘Trailblazer Investor Summits’ which will be held in central London. With investment at the heart of this summit, the agenda includes a number of thought-provoking key notes depicting current…
Adds Support for DisplayPort 2.1 for Increased Bandwidth and Higher Data Rates, Lower Power and Ultra High-Resolution Video Quality LAUSANNE, SWITZERLAND –– OCTOBER, 19, 2022 –– Kandou today began volume production of the next generation in the Matterhorn™ family of USB-C® multiprotocol retimers solutions for USB4®, adding support for DisplayPort 2.1…